Dry Etching Gas Difluoromethane

Dry etching, also known as plasma etching, uses high-energy plasma to remove material from the surface of a wafer. Plasma consists of chemically reactive ions and free radicals that bombard the wafer, breaking the material's molecular bonds and causing them to be etched away. Dry etching techniques include reactive ion etching (RIE), plasma etching, and ion etching. Dry etching allows for better control of the etching process, provides higher resolution, and is able to etch more complex structures

R32, also known as Difluoromethane, is a highly effective etching gas that is widely utilized in the plasma etching processes within the electronics industry. Furthermore, it is an outstanding coolant that doesn't deplete the ozone layer and is widely utilized in refrigeration equipment such as air conditioners, fridges, and car air conditioners. Embracing this eco-friendly coolant not only ensures that we are doing our part for the environment but also guarantees that we can maintain optimal temperatures for our devices while operating with maximum efficiency. R32 truly presents a remarkable solution that meets the diverse needs in the industry today.